发明名称 |
THERMAL PRINTHEAD MANUFACTURE |
摘要 |
<p>Thermal heater chip (1) is located within an opening of TAB circuit tape (5) and the TAB leads (3) are welded to the chip. This assembly is turned so that the underside of the leads face upward, and a curable, electrically insulative liquid is applied and cured to form a solid (11). The bottom of the chip is then attached to a heat radiating support (7) using heat conductive adhesive. The cured solid on the leads prevents any adhesive reaching the leads from causing an electrical shunt. The resulting printhead dissipates excess heat from the chip well from the support.</p> |
申请公布号 |
EP1098767(B1) |
申请公布日期 |
2005.01.26 |
申请号 |
EP19990922862 |
申请日期 |
1999.05.07 |
申请人 |
LEXMARK INTERNATIONAL, INC. |
发明人 |
GIBSON, BRUCE, DAVID;SALDANHA SINGH, JEANNE, MARIE |
分类号 |
B32B37/06;B41J2/16;(IPC1-7):B32B31/26;B32B31/28 |
主分类号 |
B32B37/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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