Test arrangement for bond pad

摘要

A bonding pad test configuration for establishing whether or not a semiconductor chip is bonded. The test configuration has a circuit that evaluates a state of a bond between a bonding wire and the bonding pad and is able to activate and deactivate operating and test modes depending on the bond state established. To this end, the bonding pad is divided into at least two parts, so that the circuit produced in the semiconductor chip itself can use signals derived from the parts of the bonding pad to establish whether or not the bonding wire is in contact with the parts.