发明名称 Verfahren zum Abtragen von Oberflächenschichten von elektrischen und bzw. oder elektronischen Bauelementen mittels gebündelter Laserstrahlung
摘要 <p>1,255,373. Making electrical components; cutting by lasers. SIEMENS A.G. 1 Dec., 1969 [29 Nov., 1968; 2 Dec.; 1968], No. 58562/69. Headings B3A and B3V. [Also in Division H1] A method of manufacturing components e.g. resistors, thin-film circuits and capacitors comprises providing a carrier body with an overall layer of a material, and a further coating with an absorptive characteristic with respect to a beam of electromagnetic radiation used to burn off required areas of the layer of material. A cylindrical ceramic body 1 has a carbon layer 2 with a varnish coating 3 as the absorptive coating. A laser beam e.g. from a CO 2 laser is then focused to a point 8 on the carbon layer, axial and rotating movement causing a helical groove to be burnt in the carbon. Pigments e.g. BaSO 4 added to the varnish vary its absorption relative to the frequency of the radiation used. Suggested coating materials include silicone polyesterimide alkyd and phenolic resin and polymide varnishes. The method is said to be suitable for metal, metal oxide and glaze layers or thin non-metallic layers e.g. insulation.</p>
申请公布号 AT297153(B) 申请公布日期 1972.03.10
申请号 AT19690011117 申请日期 1969.11.27
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人
分类号 B23K26/00;B23K26/18;H01C17/242;(IPC1-7):H01C7/02 主分类号 B23K26/00
代理机构 代理人
主权项
地址