| 摘要 |
An installation vertical groove (13) is formed in a circuit member-installing surface (12) of a resin-molded panel (11). Then, a flat circuit member (14) is inserted into the installation vertical groove, so that the flat circuit member is installed in such a manner that this flat circuit member stands in a direction perpendicular to the circuit member-installing surface. The installation vertical groove has opposed surfaces which are spaced from each other by a distance, corresponding to a thickness of the flat circuit member and are disposed perpendicularly to the circuit member-installing surface, and this installation vertical groove is formed to be disposed below the circuit member-installing surface.
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