发明名称 |
Bonding a metal component to a low-k dielectric material |
摘要 |
A dielectric material is strengthened by bonding a metal component to the dielectric matrix. The metal component may be a metal oxide or metal oxide precursor. The metal component may be deposited on the substrate with the dielectric material, or sol-gel chemistry may be used and the liquid solution spin-coated on a substrate.
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申请公布号 |
US6846755(B2) |
申请公布日期 |
2005.01.25 |
申请号 |
US20030369931 |
申请日期 |
2003.02.18 |
申请人 |
INTEL CORPORATION |
发明人 |
KLOSTER GRANT M.;LEU JIHPERNG |
分类号 |
H01L21/316;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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