发明名称 |
Semiconductor circuit with mechanically attached lid |
摘要 |
One aspect of the invention is a semiconductor circuit comprising a semiconductor die electrically connected to a package substrate through a plurality of electrical contacts. A lid above and substantially parallel to the top surface of the die forms a portion of the semiconductor circuit package. A plurality of lid supports each comprising a post and standoff member collectively create a separation between the lid and top surface of the die.
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申请公布号 |
US6847106(B1) |
申请公布日期 |
2005.01.25 |
申请号 |
US20030676669 |
申请日期 |
2003.10.01 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HOWARD GREGORY E.;SWANSON LELAND S. |
分类号 |
H01L23/10;H01L23/24;H01L23/40;(IPC1-7):H01L23/22;H01L23/48;H01L23/04;H01L23/12 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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