发明名称 |
Packaged semiconductor device for radio frequency shielding |
摘要 |
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.
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申请公布号 |
US6847115(B2) |
申请公布日期 |
2005.01.25 |
申请号 |
US20010946553 |
申请日期 |
2001.09.06 |
申请人 |
SILICON BANDWIDTH INC. |
发明人 |
CRANE, JR. STANFORD W.;JEON MYOUNG-SOO;ALCARIA VICENTE D. |
分类号 |
H01L23/057;H01L23/498;H01L23/552;(IPC1-7):H05K9/00;H01L29/04 |
主分类号 |
H01L23/057 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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