发明名称 |
High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit |
摘要 |
A ground electrode and a terminal electrode are formed on a first main surface of dielectric substrate forming a circuit board. Wiring electrodes are formed on a second main surface of the dielectric substrate. A semiconductor device and a filter are mounted on the wiring electrodes. A strip line electrode of the filter is connected to the ground electrode of the circuit board for conducting direct current, via a through-hole provided in the filter, a ground electrode of the filter, the wiring electrode, and a through-hole provided in the circuit board. With this arrangement, the terminal electrode is connected to a high-frequency signal terminal of the semiconductor device via the filter.
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申请公布号 |
US6847275(B2) |
申请公布日期 |
2005.01.25 |
申请号 |
US20010974668 |
申请日期 |
2001.10.10 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SAYANAGI KAZUYA;SASABATA AKIHIRO;SASAKI YUTAKA |
分类号 |
H01L23/12;H01L23/00;H01L23/66;H01L25/00;(IPC1-7):H01L21/58;H01P3/08 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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