Method of fabricating devices incorporating microelectromechanical systems using UV curable tapes

摘要

A method of fabricating devices incorporating microelectromechanical systems (MEMS) using UV curable tapes includes providing a silicon substrate 12 with a MEMS layer 14 arranged on one side of the substrate 12. A first UV curable tape 22 is applied to the MEMS layer 14. At least one operation is performed on the substrate 14 via an opposed side of the substrate 14. A second UV curable tape 32 is applied to the opposed side of the substrate 14 and the first tape 22 is removed by exposing it to UV light. At least one operation is performed on the MEMS layer to form individual MEMS chips which are able to be removed individually from the second UV tape 32 by localised exposure of the tape 32 to UV light.