发明名称 |
Method of fabricating microelectronic connections using masses of fusible conductive material |
摘要 |
A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.
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申请公布号 |
US6846700(B2) |
申请公布日期 |
2005.01.25 |
申请号 |
US20020146353 |
申请日期 |
2002.05.15 |
申请人 |
TESSERA, INC. |
发明人 |
SMITH JOHN W. |
分类号 |
H01L21/56;H01L23/055;H01L23/48;H01L23/485;H01L23/498;(IPC1-7):H01L21/48;B23K31/02 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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