| 摘要 |
PURPOSE: An apparatus and a method for detecting the failure of an integrated circuit are provided to detect the failure intermediately generated by the temperature and the humidity by comparing the acquired image with the reference image of each temperature level. CONSTITUTION: An apparatus and a method for detecting the failure of an integrated circuit includes an X-ray generator(10), a hot plate(20), a temperature detection sensor(32), a base(22), a photo-multiplier(24), a camera unit(26), a controller(28), a display unit(30) and an X-ray controller(16). The X-ray generator generates and illuminates the X-ray. The hot plate heats the integrated circuit to be measured below the X-ray generator. The temperature detection sensor is installed adjacent to the hot plate. The base fixes the hot plate. The photo-multiplier is place below the base to detect and amplify the X-ray. The camera unit is place below the bottom of the photo multiplier to detect the structure of the integrated circuit and to convert the detected data into a digital data. The controller detects the failure by comparing the image detected in response to the increment of the temperature. The display unit displays the comparison image and the result in response to the control signal of the controller. And, the X-ray controller controls the X-ray generator in response to the control signal of the controller.
|
