发明名称 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF FOR DETERMINING JOINING CONDITION OF EXTERNAL TERMINALS AND LANDS
摘要 PURPOSE: A semiconductor device and a fabricating method thereof are provided to determine a joining condition of external terminals and lands by enhancing visual identifiability of a joining agent deposited on the external terminals. CONSTITUTION: A semiconductor device includes a semiconductor element and a plurality of electrodes(104) electrically connected to the semiconductor element. The semiconductor element and the electrodes are sealed by a sealing agent(107) having an insulating property. The electrodes are exposed around a mounting surface that is joined via a joining agent(300) to an external mounting circuit board. The electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.
申请公布号 KR20050009183(A) 申请公布日期 2005.01.24
申请号 KR20040054597 申请日期 2004.07.14
申请人 KANTO SANYO SEMICONDUCTORS CO., LTD.;SANYO ELECTRIC CO., LTD. 发明人 KAMEYAMA, KOUJIRO;MITA, KIYOSHI
分类号 H01L23/12;H01L21/68;H01L23/31;H01L23/48;H01L23/495;H05K3/34 主分类号 H01L23/12
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