| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BONDING PAD THEREOF FOR PREVENTING WIRE BONDING ERROR WITHOUT PRE-CLEANING PROCESS |
| 摘要 |
<p>PURPOSE: A semiconductor device and a method of forming a bonding pad thereof are provided to simplify a fabrication process by preventing a wire bonding error without performing a pre-cleaning process. CONSTITUTION: A top metal line(13) is formed on a semiconductor substrate structure(11). An insulating layer(12) is formed on an entire surface of the semiconductor substrate structure. A bonding pad for exposing a predetermined region of the top metal line is formed by etching partially the insulating layer. A post-process including a plasma etch process using CF4, Ar, and O2 gases are performed on the entire surface of the insulating layer including the bonding pad.</p> |
| 申请公布号 |
KR20050007698(A) |
申请公布日期 |
2005.01.21 |
| 申请号 |
KR20030047268 |
申请日期 |
2003.07.11 |
| 申请人 |
DONGBUANAM SEMICONDUCTOR INC. |
发明人 |
LEE, KAE HOON |
| 分类号 |
H01L21/60;H01L21/306;H01L21/311;H01L21/44;H01L21/768;H01L23/485;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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