发明名称 |
NON-VOLATILE SEMICONDUCTOR MEMORY AND FABRICATING METHOD THEREOF FOR DIRECTLY CONNECTING VIA-CONTACTS TO LOWER CONTACTS |
摘要 |
<p>PURPOSE: A non-volatile semiconductor memory and a fabricating method thereof are provided to connect directly via-contacts to lower contacts without forming data transmission line drawing parts connected to lower contacts. CONSTITUTION: A plurality of second semiconductor regions are formed on a plurality of first semiconductor regions. A plurality of isolation regions extends to a column direction in order to isolate the second semiconductor regions. A first interlayer dielectric(27) is formed on the first semiconductor regions. A lower conductive plug(CB) is buried into the first interlayer dielectric to be connected to one of the second semiconductor regions. A first wiring(56) is buried into the first interlayer dielectric and extends to a row direction. A second interlayer dielectric(29) is formed on the lower conductive plug and the first interlayer dielectric. An upper conductive plug(16) is buried into the second interlayer dielectric. A second wiring(57) is formed on the second interlayer dielectric.</p> |
申请公布号 |
KR20050008521(A) |
申请公布日期 |
2005.01.21 |
申请号 |
KR20040054832 |
申请日期 |
2004.07.14 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
GODA, AKIRA;KAJIMOTO, MIRORI;NOGUCHI, MITSUHIRO |
分类号 |
H01L21/28;H01L21/768;H01L21/8246;H01L21/8247;H01L27/115;H01L29/76;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|