发明名称 TRENCH MOS CAPACITOR OF SEMICONDUCTOR DEVICE FOR ENSURING HIGH CAPACITANCE BY CONNECTING ADDITIONALLY TOP CONDUCTIVE LAYER OF TRENCH MOS CAPACITOR TO DIODE JUNCTION CAPACITOR AND FABRICATING METHOD THEREOF
摘要 PURPOSE: A trench MOS capacitor of a semiconductor device and a fabricating method thereof are provided to ensure a high capacitance by connecting additionally a top conductive layer of the trench MOS capacitor to a diode junction capacitor. CONSTITUTION: A first junction layer(16) is formed by implanting a first conductive type impurity into a trench having a predetermined depth on a predetermined area of a semiconductor substrate(10). An insulating layer is formed on the semiconductor substrate including the first junction layer. A conductive layer is formed on the insulating layer to bury the trench. A second junction layer(24) is formed by implanting a second conductive impurity into the semiconductor substrate. A wiring(28) is formed to connect the conductive layer to the second junction layer.
申请公布号 KR20050007781(A) 申请公布日期 2005.01.21
申请号 KR20030047381 申请日期 2003.07.11
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 KIM, SEONG WOOK
分类号 H01L27/04;(IPC1-7):H01L27/04 主分类号 H01L27/04
代理机构 代理人
主权项
地址