发明名称 POLISHING PAD PREVENTING FLOWING OUT OF SLURRY FROM POLISHING PAD BY CHANGING GROOVE CONFIGURATION
摘要 PURPOSE: A polishing pad is provided to prevent flowing out of a slurry(polishing agent) from polishing pad by changing configuration of a groove. CONSTITUTION: A plurality of helix-shaped grooves(11) having a predetermined width and depth extend from the center to the peripheral on a polishing pad(10). The plurality of grooves have a repeated tooth-shaped configuration(A). The plurality of helix-shaped grooves are formed in the direction for the centrifugal force to be applied to a slurry. The plurality of grooves have a width of 1mm and a depth of more than o.5mm.
申请公布号 KR20050008051(A) 申请公布日期 2005.01.21
申请号 KR20030047736 申请日期 2003.07.14
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 JEONG, JONG YEUL
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址