发明名称 |
POLISHING PAD PREVENTING FLOWING OUT OF SLURRY FROM POLISHING PAD BY CHANGING GROOVE CONFIGURATION |
摘要 |
PURPOSE: A polishing pad is provided to prevent flowing out of a slurry(polishing agent) from polishing pad by changing configuration of a groove. CONSTITUTION: A plurality of helix-shaped grooves(11) having a predetermined width and depth extend from the center to the peripheral on a polishing pad(10). The plurality of grooves have a repeated tooth-shaped configuration(A). The plurality of helix-shaped grooves are formed in the direction for the centrifugal force to be applied to a slurry. The plurality of grooves have a width of 1mm and a depth of more than o.5mm.
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申请公布号 |
KR20050008051(A) |
申请公布日期 |
2005.01.21 |
申请号 |
KR20030047736 |
申请日期 |
2003.07.14 |
申请人 |
MAGNACHIP SEMICONDUCTOR, LTD. |
发明人 |
JEONG, JONG YEUL |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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