AUTO-MOLDING SYSTEM FOR FABRICATING SEMICONDUCTOR PACKAGE ACHIEVING COMPACTION OF WHOLE SIZE THEREOF BY COLLECTIVE ARRANGEMENT OF UNITS

摘要

PURPOSE: An auto-molding system for fabricating a semiconductor package is provided to achieve the compaction of whole size thereof by arranging units collectively. CONSTITUTION: Substrates within a magazine is supplied piece by piece by a loading unit(10). Each compound taken out one by one from a tube is employed to each set of substrates at the same time by a compound feeding unit(20). Each set of semiconductor substrates is preheated by a preheating unit(30). Semiconductor substrates of twelve pieces are capable of being pressed at the same time by one set of press molding unit(40). Remaining compound residues etc. after molding are removed by a cleaner unit(50). A resin supply inlet and a curl of runner molded in a press molding process are removed by a degate unit(60). A completed semiconductor substrate is taken out of an unloading unit(70).