发明名称 |
METHOD OF MANAGING POLISHING APPARATUS FOR REDUCING POLISHING IRREGULARITY ON WAFER AND IMPROVING POLISHING ACCURACY |
摘要 |
PURPOSE: A method of managing a polishing apparatus is provided to reduce the polishing irregularity on a wafer and improve the polishing accuracy by monitoring and controlling an actual downforce. CONSTITUTION: A calculation process is performed to calculate a difference between a first downforce detected by a downforce detecting unit at a first period at which a polishing apparatus stands by for polishing a wafer, and a second downforce detected by the downforce detecting unit at a second period at which the polishing apparatus polishes the wafer, as an actual downforce actually applied to the wafer at the second period(ST1). A monitoring process is performed to monitor the actual downforce(ST2,ST3).
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申请公布号 |
KR20050008504(A) |
申请公布日期 |
2005.01.21 |
申请号 |
KR20040054661 |
申请日期 |
2004.07.14 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
IMAI, SHINICHI;MIYASAKA, KOUTARO |
分类号 |
H01L21/304;B24B21/04;B24B37/04;B24B49/16;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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