| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for separating and removing well a resist which is stuck to the uneven step of the article surface of a silicon wafer, etc. from the article surface without causing a separation residue. SOLUTION: In a resist removing method, an adhesive layer is provided on an article in which a resist exists, and the adhesive layer and resist are integrally separated from the article. There is the uneven step on the article surface, a fine gap is provided between a bottom of this step and the resist, and a length L in the direction of the article surface of this gap is set as L=(1/20)h to 2h, with respect to the height h of the step. COPYRIGHT: (C)2005,JPO&NCIPI |
