| 摘要 |
PROBLEM TO BE SOLVED: To make preventable the occurrences of defects by suppressing warpage of a package and to suppress the increase of the thickness of the package. SOLUTION: A semiconductor device with a semiconductor chip mounted thereon is provided with a first substrate 14 on which the semiconductor chip 11 is mounted, a second substrate 17 provided with an opening 18 which is larger than the size of the first substrate 14 in a planar direction, and a flexible connecting member 19 for electrically and mechanically connecting the first and second substrates 14, 17 with the first substrate 14 disposed in the opening 18 of the second substrate 17. COPYRIGHT: (C)2005,JPO&NCIPI
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