| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for sealing an electronic component with a resin by which the connection reliability between active and passive components and a circuit board and the mounted density and strengths of the components can be improved, by surely and accurately infiltrating and packing a sealing resin having a high viscosity and low fluidity into and in the spaces between the components and circuit board. SOLUTION: After a circuit board 1 with the sealing resin 4 mounted thereon, active components 2, and passive components 3 is inserted into a vacuum-pressing chamber 14, the atmosphere in the chamber 14 is changed from the atmospheric pressure to a vacuum pressure by operating a vacuum pump 7, a compressor 17, and a leak valve 19. Then the peripheries of the electronic components 2 and 3 and the sealing resin 4 are deaerated and the resin 4 is injected into and packed in the spaces between the components 2 and 3 and circuit boards 1. After the sealing resin 4 is left as it is in the vacuum pressure atmosphere for a prescribed period of time, the resin 4 is infiltrated into and packed in the spaces by utilizing a pressure difference in a pressurized atmosphere formed in the vacuum-pressing chamber 14 by supplying air into the chamber 14. COPYRIGHT: (C)2005,JPO&NCIPI
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