| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system for manufacturing a TAB (tape automated bonding) package in which the coating amount of sealing resin becomes constant even if the interval of leads is difference in the TAB package. SOLUTION: A through hole 3 is formed in a TAB tape composed of insulating resin having leads 4 on one major surface, the lead 4 extending through the through hole 3 and the corresponding electrode pad of a semiconductor chip 5 are superposed and bonded, sealing resin is applied onto a mask having an opening 9 at a position corresponding to the through hole 3, sealing resin is applied to the TAB tape by means of a squeegee 10 moving on the mask and then the sealing resin is cured. In such a process for manufacturing a TAB package, moving speed of the squeegee 10 is made varable depending on the interval of the leads 4. COPYRIGHT: (C)2005,JPO&NCIPI
|
