| 摘要 |
PROBLEM TO BE SOLVED: To perform the positioning of an object to be inspected at a high speed, and to detect abnormality on the surface of the object to be inspected in a short time. SOLUTION: An optical beam spread with respect to an X-direction is directed obliquely with respect to a Y-direction, from a relay lens 25 toward the surface of the semiconductor chip accommodated in a tray 2 to be irradiated therewith, and an optical beam spread with respect to the Y-direction is directed obliquely with respect to the X-direction. An area camera 40 acquires an image of the surface of the semiconductor chip, and outputs an image signal to an image processing/controlling device 100. When the semiconductor chip is inclined with respect to a Z-direction, the two optical beams do not perpendicularly cross on the surface of the semiconductor chip, or the intersection point is off the center. When the surface of the semiconductor chip is not at a prescribed height, the intersection point is also off the center. Further, when the semiconductor is displaced or rotated with respect to the X-Y directions, an alignment mark of the surface of the semiconductor chip is off a prescribed position. A CPU 110 detects the position and the rotation of the semiconductor chip with respect to the X-Y-directions and the height and the inclination with respect to the Z-direction, from image data stored in an image memory 120. COPYRIGHT: (C)2005,JPO&NCIPI
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