ETCHING TREATMENT METHOD AND ETCHING TREATMENT DEVICE FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a device where treatment tanks are not required to be so enlarged for corresponding to the enlargement of a substrate, and the defect in etching does not occur as in the case where dipping treatment is performed. SOLUTION: The device is provided with: a first treatment tank 14; conveyance rollers 20 arranged at the inside of the first treatment tank 14 and supportingly conveying a substrate W; spray nozzles 22 arranged at the upper part of a substrate conveyance path and jetting an etching liquid toward the surface of the substrate W; a second treatment tank 28 connected to the first treatment tank 14; conveyance rollers 30 arranged at the inside of the second treatment tank 28 and supportingly conveying the substrate W; and a discharge nozzle 32 feeding the etching liquid to the surface of the substrate W carried out from the inside of the first treatment tank 14 and carried into the second treatment tank 28 and applying the etching liquid to the whole of the surface of the substrate W. COPYRIGHT: (C)2005,JPO&NCIPI