发明名称 |
Modular power semiconductor module |
摘要 |
A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.
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申请公布号 |
US2005012190(A1) |
申请公布日期 |
2005.01.20 |
申请号 |
US20040821308 |
申请日期 |
2004.04.09 |
申请人 |
SEMIKRON ELEKTRONIK GMBH |
发明人 |
MANZ YVONE;GRUBER MARKUS;WAHI ASEEM |
分类号 |
H01L25/07;H01L25/11;H01L25/18;(IPC1-7):H01L29/76 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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