| 摘要 |
A method of manufacturing an adhesiveless flexible substrate modifies a surface of an electrically insulative flexible base material by plasma polymerization technology to form a layer of plasma polymer on a surface of the electrically insulative flexible base material before plating a copper layer on the base material so as to improve the bond strength of the copper layer and the base material. Because the layer of plasma polymer has a thin thickness and excellent mechanical properties, the adhesiveless flexible substrate is highly flexible.
|
