发明名称 BINDER DIFFUSION PATTERNING OF A THICK FILM PASTE LAYER
摘要 The present invention concerns a process for the fabrication of electrical and electronic devices. A polymer film is patterned on a substrate. A thick film paste is deposited over the patterned polymer. The thick film paste is dried under conditions which allow diffusion of the polymer into the thick film paste. This renders the diffused area insoluble in alkaline development solution.
申请公布号 WO2004066364(A3) 申请公布日期 2005.01.20
申请号 WO2004US03571 申请日期 2004.01.21
申请人 E.I. DU PONT DE NEMOURS AND COMPANY;CHENG, LAP-TAK, ANDREW 发明人 CHENG, LAP-TAK, ANDREW
分类号 G03F7/00;H01L21/48;H05K1/09;H05K3/02 主分类号 G03F7/00
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