发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing an alkali-soluble resin and a photosensitive agent, the composition which holds flatness of the film surface even after high temperature baking and from which a thin film having favorable transmittance for light can be obtained, which has high stability with time, and in particular, which is suitable for the formation of an interlayer dielectric, a flattening film or the like, and to provide a flat panel display and a semiconductor device using the composition. <P>SOLUTION: The photosensitive resin composition containing an alkali-soluble resin, a photosensitive agent having a quinonediazide group, and a curing agent is characterized in that: the alkali-soluble resin is an acrylic resin, the photosensitive agent having a quinonediazide group is a reaction product of a phenolic compound expressed by general formula (I) and a naphthoquinone diazide compound; and the curing agent contains an epoxy group. In formula, each of R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>, R<SP>4</SP>independently represents H or a 1-2C alkyl group, and each of R<SP>5</SP>and R<SP>6</SP>independently represents a 1-2C alkyl group. If necessary, a phenolic compound and a curing promoter are incorporated into the photosensitive resin composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005017666(A) 申请公布日期 2005.01.20
申请号 JP20030182087 申请日期 2003.06.26
申请人 CLARIANT INTERNATL LTD 发明人 TAKAHASHI SHUICHI
分类号 G03F7/022;G03F7/00;G03F7/004;G03F7/033;G03F7/038;G03F7/09;G03F7/40;H01L21/027 主分类号 G03F7/022
代理机构 代理人
主权项
地址