| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket allowing electric contacts to be arranged with high density, and capable of preventing deformation of the electric contacts by external force. SOLUTION: This IC socket 1 is provided with an insulation housing 2 having an IC package receiving recessed part 14 for receiving an IC package 76. Contacts 8 are arranged in cavities 30 arranged in a matrix-like form in the recessed part 14. Each contact 8 has a base part 40 pressed in the cavity 30; a contact arm part 44 extending by being offset above the cavity 30 adjacent in one direction on the upper side of the base part 40; and a connection part 48 electrically connected to a substrate 20 on the lower side of the base part 40. In the insulation housing 2, other housing walls 70 higher than housing walls 72 between the lines of the adjacent cavities 30 adjacent in one direction are formed between the lines of the cavities 30 adjacent in the other direction perpendicular to the one direction. COPYRIGHT: (C)2005,JPO&NCIPI
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