发明名称 METALLIC ABRASIVE COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a metallic abrasive composition capable of polishing metal such as Ta at a high speed, having high cleaning performance to a hydrophobic low dielectric constant film, and superior in preservation stability without precipitating abrasive grains in storing. <P>SOLUTION: This metallic abrasive composition is characterized by including a anionic surface active agent having two or more anionic functional groups, the abrasive grains, and inorganic salt in a molecular structure. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005014206(A) 申请公布日期 2005.01.20
申请号 JP20040158830 申请日期 2004.05.28
申请人 SUMITOMO CHEMICAL CO LTD 发明人 KATSUTA OSAYUKI;MATSUMI YASUO;TAKASHIMA MASAYUKI;ICHIKI NAOKI
分类号 B24B37/00;C09K3/14;H01L21/304;(IPC1-7):B24B37/00 主分类号 B24B37/00
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