| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board which can shorten the time required to laminate a plurality of wiring boards in the lamination of the multilayer wiring boards, and which can prevent voids from occurring. SOLUTION: The method of manufacturing the multilayer wiring board obtained by laminating a connecting wiring board with respect to a wiring board to be connected, includes a step of placing the wiring board to be connected and the connecting wiring board in a pair of pressurizing stages provided in a chamber, and is characterised aligning and laminating the wiring board to be connected and the connecting wiring board, and is characterised in that the inside of the chamber is held in a reduced pressure atmosphere while manufacturing at least one unit of the multilayer wiring board. At least one of the pressurizing stages has a function of holding the wiring board to be connected and/or the connecting wiring board by an electromagnetic chuck. COPYRIGHT: (C)2005,JPO&NCIPI |
