| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal treatment jig and a thermal treatment method capable of effectively suppressing occurenses of scratches or slips even if thermal treatment is carried out at high tmperatures of not less than 1,000°C. SOLUTION: The thermal treatment jig 1a which holds the wafer W when thermal treatment comprises at least a jig body 4a composed of hard material not defomed at the time of thermal treatment, and a holding part 2a with its at least surface 3a contacting with the wafer composed of a soft material softened more than the hard material when heat treating, preferably the same material as the wafer to be thermal treated, or the material with its hardness smaller than that of the wafer at the time of thermal treatment. COPYRIGHT: (C)2005,JPO&NCIPI |
