| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealing apparatus which can sufficiently seal a comparatively large area with resin without increasing the manufacture cost considerably and to provide its semiconductor device manufacturing method. SOLUTION: The resin-sealing apparatus includes a lower mold 103 facing on a circuit forming surface of a semiconductor wafer 109. A plated layer with amorphous organic fluorine is formed on the surface of the lower mold 103. The releasability between the semiconductor wafer 109 and the lower mold 103 after resin-sealing is improved by the existence of the plated layer. COPYRIGHT: (C)2005,JPO&NCIPI |
