| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an MR head capable of reliably performing ESD (ElectroStatic discharge) protection before assembly of an HGA (Head Gimbal Assembly) without excessively occupying a wafer surface. SOLUTION: The method for manufacturing the MR head comprises the steps of: forming a plurality of thin film MR heads on a substrate (wafer); forming thin film shorting patterns on the wafer surface to electrically short pairs of thin film connecting pads which are electrically connected to the respective MR heads; and then electrically cutting the shorting patterns by laser irradiation in a prescribed process. The method for manufacturing the HGA provided with such MR head is also provided. COPYRIGHT: (C)2005,JPO&NCIPI
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