发明名称 PROBE
摘要 PROBLEM TO BE SOLVED: To provide a probe for a probe card for measuring various electric characteristics of a semiconductor device such as an LSI chip. SOLUTION: In this probe for inspecting the semiconductor device, the probe has a hardness difference between a tip part and a barrel part, and is formed to make a hardness in the probe tip part higher than that of in a probe root part. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005017258(A) 申请公布日期 2005.01.20
申请号 JP20030205462 申请日期 2003.08.01
申请人 JAPAN ELECTRONIC MATERIALS CORP 发明人 MORI CHIKAOMI;SATO KATSUHIKO
分类号 G01R31/26;G01R1/067;H01L21/66;(IPC1-7):G01R1/067 主分类号 G01R31/26
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