| 摘要 |
PROBLEM TO BE SOLVED: To highly precisely cut an ultraviolet-ray-setting adhesive tape with the tape applied to a workpiece. SOLUTION: A region of the adhesive tape T bonded to the surface of a wafer W to be cut by a cutter edge 44 is irradiated with ultraviolet rays from an ultraviolet ray irradiation nozzle 50 in advance, so that an adhesive material is hardened. The wafer W is cut while the cutter edge 44 moves on the region where the adhesive material is hardened, that is, along the outline of the wafer W. COPYRIGHT: (C)2005,JPO&NCIPI
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