| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent moldability and giving a cured product having excellent appearance free from the generation of wax bleeding, die mark at the gate part, etc., and exhibiting excellent crack resistance in soldering even in a moisture-absorbed state of the encapsulation resin for the surface mounting package and provide a semiconductor device encapsulated with the cured product of the resin composition. SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a melt mixture of (D1) a polyether-modified polysiloxane and (D2) a mold release agent. The semiconductor device is encapsulated with the cured product of the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI |
