发明名称 HEAT ACCUMULATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat accumulating device in which heat medium after passing through a latent heat material reaches low temperature in accumulating heat, and in which heat medium after passing through the latent heat material reaches high temperature in emitting heat, that achieves high heat accumulation efficiency. SOLUTION: In this heat accumulating device, a plurality of kinds of latent heat material having different fusing points are used for accumulating heat. The latent heat material of the higher fusing point is disposed on the inlet/outlet side of a heat accumulating tank where high-temperature heat medium passes. The latent heat material of the lower fusing point is disposed on the inlet/outlet side of the heat accumulating tank where low-temperature heat medium passes. In accumulating heat, heat medium cooled by the latent heat material of the lower fusing point is fed, so that heat accumulation efficiency is improved. In emitting heat, heat medium heated by the latent heat material of the higher fusing point can be supplied. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005016766(A) 申请公布日期 2005.01.20
申请号 JP20030178993 申请日期 2003.06.24
申请人 RINNAI CORP 发明人 WATARAI TATSUKI
分类号 F24H7/02;F24D11/00;F24F5/00;F28D20/02;(IPC1-7):F28D20/02 主分类号 F24H7/02
代理机构 代理人
主权项
地址