发明名称 MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface acoustic wave element capable of minimizing damages by etching, increasing the production yield of the surface acoustic wave element and also improving the reliability. SOLUTION: The manufacturing method comprises: an electrode forming step of forming an interdigital electrode 5 on the surface acoustic wave element part 2a formed on a wafer; a resist forming step of forming resist 19 at the surface acoustic wave element part 2a other than the vicinity of the interdigital electrode 5 and a reflector 6 and an opening part 12a which is a part of an excitation pad 12; a frequency measuring step of inputting excitation signals to the opening part 12a of the excitation pad 12 and measuring the frequency of the surface acoustic wave element part; a frequency adjusting step of adjusting the frequency of the surface acoustic wave element part 2a by etching; and a surface acoustic wave element separating step of cutting out the surface acoustic wave element part after frequency adjustment from the wafer and separating the surface acoustic wave element. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005020404(A) 申请公布日期 2005.01.20
申请号 JP20030182818 申请日期 2003.06.26
申请人 SEIKO EPSON CORP 发明人 MITSUI YUJI
分类号 H03H3/10;H03H9/145;(IPC1-7):H03H3/10 主分类号 H03H3/10
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