INSPECTION APPARATUS FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an inspection apparatus for a semiconductor deice for minimizing fraction defective of the semiconductor device that may be caused depending on temperature conditions, by testing durability of the semiconductor device against a temperature. SOLUTION: The inspection apparatus for a semiconductor deice comprises: a match plate 20; a contact module 50 equipped with a radiating part 30 in contact with the semiconductor device 70 and a test part 40 for press-contact of lead wires 72 of the semiconductor device 70; and a heat conductive pad 60 adhered on a contact face of the radiating part 30 disposed to the contact module 50 and brought into contact with the semiconductor device 70, so as to transmit the heat generating from the semiconductor device 70 to the radiating part 30 of the contact module 50. Therefore, the reliability of the test of the durability of the semiconductor device against the temperature can be improved. COPYRIGHT: (C)2005,JPO&NCIPI