| 摘要 |
An in-tray burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices disposed in one or more processing trays. The in-tray burn-in board includes a plurality of electrical contacts disposed on an interface surface for establishing, through engagement with one or more processing trays, electrical communication between the leads of the integrated circuit devices and a tester. One or more in-tray burn-in boards may each be coupled with at least one processing tray, such that a plurality of integrated circuit devices may be subjected to burn-in and other electrical testing without removing the integrated circuit devices from the processing trays, thereby reducing the time and cost associated with handling integrated circuit devices during manufacturing.
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