发明名称 Substrate joining method and apparatus
摘要 A joining roller rolls on the surface of a reinforcing substrate held by a center and side latch claws so as to be close and opposite to an wafer placed and held on a holding table in the condition that an adhesive sheet is adhered on the surface, whereby joining proceeds. As the joining roller rolls, both of the latch claws oscillate downward and the latch claws themselves move down while keeping the bend of the reinforcing substrate nearly constant, and retract when the joining roller approaches the latch claws.
申请公布号 US2005014345(A1) 申请公布日期 2005.01.20
申请号 US20040875165 申请日期 2004.06.25
申请人 MIYAMOTO SABURO;HASE YUKITOSHI;IRIE MASARU 发明人 MIYAMOTO SABURO;HASE YUKITOSHI;IRIE MASARU
分类号 H01L21/683;H01L21/00;H01L21/02;H01L21/301;H01L21/304;H01L21/52;(IPC1-7):H01L21/30;H01L21/320 主分类号 H01L21/683
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