| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-density chip scale package employing a heat radiation structure that widens solder ball formation effective area for package area and increases a pin count. <P>SOLUTION: Provided are a die where a circuit pattern is formed, a printed circuit board which is mounted with the die and 100 to 150% of the die area, and includes the circuit pattern, a heat radiation plate which is mounted on the die to radiate the heat of the die, and a sealant which is injected between the printed circuit board and heat radiation plate to bring the printed circuit board and heat radiation plate into contact with each other and shields the printed circuit board from outside. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
