| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating bath for coating a roughed conductive base material with a thin film resistance layer having a uniform thickness, the conductive base material with the thin film resistance layer showing a stable restance, and a restance circuit board material using the condcutive base material with the thin film resitance layer. SOLUTION: The plating bath for coating the conductive base material with the thin film resistance layer is characterised by containing copper as an essential component, at least one of salts from among the salts of phosphoric acid, phosphorous acid, and phosphinic acid, and also at least one of nickel, cobalt, and chromium. The conductive base material with the thin film resistance layer formed in the plating bath is used for the resistance circuit board material. COPYRIGHT: (C)2005,JPO&NCIPI
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