| 摘要 |
PROBLEM TO BE SOLVED: To obtain a cooler performing heat absorption and cooling depending on the heat generation temperature distribution of a heat generating body and enhancing the heat exchanging performance of a heat generating body having temperature distribution including a peak value. SOLUTION: The cooler comprises a heat sink 1 thermally coupled with a semiconductor device 2 so that heat is absorbed into refrigerant in a heat exchanging chamber 12, a radiator for radiating heat by leading refrigerant from the heat sink 1, a first refrigerant transfer tube 5 for transferring the refrigerant from which heat is radiated by the radiator to the heat sink 1, a second refrigerant transfer tube 6 for transferring the refrigerant from which heat is absorbed by the heat sink to the radiator, and a refrigerant pump provided in the first refrigerant transfer tube 5 wherein the first refrigerant transfer tube 5 is connected to one end side of the heat sink 1 and a refrigerant inlet 13 is opened to the heat exchanging chamber 12. Furthermore, the second refrigerant transfer tube 6 is connected to the other side and a refrigerant outlet 14 is opened to the heat exchanging chamber 12, a guide groove 15 passing the central part corresponding to the high heat generating part 2a of the semiconductor device 2 is formed in the bottom heating surface of the heat exchanging chamber 12 such that refrigerant flow from the refrigerant inlet 13 is guided to the central part. COPYRIGHT: (C)2005,JPO&NCIPI
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