| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device of a semiconductor device wherein compactness of a whole of equipment is realized, while keeping a distance for eliminating blasting irregularity between a heat dissipating fan and a radiator such as a condenser. SOLUTION: A duct 6 for forming a space is formed between the condenser 3 and the heat dissipating fan 4 and a refrigerant bump 5 is housed in a space inside the duct 6. Since the duct 6 is provided between the condenser 3 and the heat dissipating fan 4, air is blown to the condenser 3 without generating blasting irregularity, thus improving heat efficiency in the condenser 3. Furthermore, since the refrigerant pump 5 is housed in the duct 6, miniaturization is realized by reducing an installation space of the whole of equipment. COPYRIGHT: (C)2005,JPO&NCIPI
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