发明名称 RESIN MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin molding method capable of molding a resin by an injection molding method or the like and capable of obtaining a light transmittable pattern of which the boundary is clear. SOLUTION: In the resin molding method for mixing and heating a mixture of a first thermoplastic resin material and a second thermoplastic resin material mutually different in optical characteristics after molding to mold a molded product having a plate-shaped portion at least a part thereof, the melting point of the first thermoplastic resin material is lower than that of the second thermoplastic resin material and a melting temperature at molding is set so as to be higher than the melting point of the first thermoplastic resin material but lower than the melting point of the second thermoplastic resin material. Pellets of a polystyrene resin with a melting point of 200°C are used as the first thermoplastic resin material and a ground material of a non-melt type acrylic resin with a melting point of about 280°C is used as the second thermoplastic resin material. A molding temperature is set to about 230°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005014282(A) 申请公布日期 2005.01.20
申请号 JP20030179319 申请日期 2003.06.24
申请人 NAKANO DENKI KK 发明人 NAKANO JUN
分类号 B29C45/16;B29C45/00;(IPC1-7):B29C45/00 主分类号 B29C45/16
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