发明名称 OXIDATION-RESISTANT SOLDER, METHOD FOR MANUFACTURING THE SAME, AND SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide oxidation-resistant solder which is capable of suppressing generation of oxidation products and void defects, and excellent in heat conductivity, wettability and mechanical properties, a method for manufacturing the same, and a soldering method. SOLUTION: The oxidation-resistant solder contains, by weight, 0.02-12% first sub component consisting of at least one kind of metal selected from Cu, Ag, Au, Co and Ni, and 0.02-1.2% second sub component consisting of at least one kind of metal selected from Mn, Pd and Pt, and the balance Sn with inevitable impurities. The oxidation-resistant solder can suppress production of oxides in intermetallic compounds by forming a solid solution with the second sub component, and heat conductivity, wettability, solder strength, heat fatigue strength, etc. can be enhanced thereby. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005014076(A) 申请公布日期 2005.01.20
申请号 JP20030185845 申请日期 2003.06.27
申请人 TOSHIBA CORP 发明人 TAN TORONRON;NABA TAKAYUKI
分类号 B23K1/20;B22F9/08;B23K3/06;B23K31/02;B23K35/26;B23K35/40;C22C13/00;(IPC1-7):B23K35/26 主分类号 B23K1/20
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