| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a composition giving sufficient adhesive strength in low temperature contact bonding at ≤20°C and excellent in chemical resistance, soldering heat resistance, processability, and the like, and to provide an adhesive and an adhesive film using the composition. <P>SOLUTION: A modified polyamide epoxy resin is obtained by reacting (I) an acid terminal polyamide resin with (II) an epoxy resin at ≥1 molar ratio of epoxy groups/carboxyl groups, wherein the acid terminal polyamide resin is prepared by reacting (A) dicarboxylic acids with (B) an organic diisocyanate at >1 molar ratio of the carboxyl groups/the isocyanate groups, which dicarboxylic acids contain (a) a both terminal carboxylic acid compound having a polyalkylene glycol residue or a polycarbonate diol residue and (b) an aliphatic or aromatic polycarboxylic acid. The above composition comprises the modified polyamide epoxy resin, an epoxy resin and an epoxy resin-curing agent. The adhesive and the adhesive film are obtained by using the composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
