| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging material of a lamination structure to be used for packaging, which is highly resistant to boil-retort sterilization treatment and especially, is free from any concern about conventional adhesive-derived problems of a residual solvent and an eluated substance as pointed out in a composite packaging material with an adhesive layer and shows excellent adhesive strength and an unabated adhesive strength even when exposed to a high temperature during boil retort sterilization treatment and the like, without paying much attention to a peeling issue, and a method for manufacturing the packaging material. SOLUTION: The packaging material 1 is of such a structure that a heat-sealable film layer 4 is laminated on a base material film 2 through an extrusion laminated resin layer 3 made of a lamination resin containing at least a straight-chain low-density polyethylene and a high melting point component. COPYRIGHT: (C)2005,JPO&NCIPI
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